Metallization Technology (PVD)

Physical Vapor Deposition (PVD) is the process where a metallic layer is deposited on a non-metallic substrate. This process is a cost-e ective way of shielding plastic housings against Electromagnetic interference.

Form-In-Place Dispensed Gasket (FIP)

Automated technology that dispenses Form-in-Place conductive elastomer gaskets on metal or plastic housings. The system applies programmed gasket beads with pinpoint accuracy in four axes.

Thermal Interface Materials

Thermally Conductive Gap Filler Pads or dispensable silicone and non-silicone jelly series.

Thermal Modules & Assembly

Custom designs for thermal management in the early stage of product development. Using thermal software simulation to design heat sinks with embedded heat pipes or water cooling cold plates.

Turnkey/End-to-End Solutions

Metal housing, form-in-place EMI gasket, thermal module, and thermal interface material. A comprehensive turnkey solution that produces an advanced functional gasket to provide reliable environmental seals.

RF & Microwave Absorbers

Automated dispensing and sheet options available for cost-effective, low-outgassing solutions with quick turnaround time.

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